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1. product profile 1.1 general description the device is designed to protect in-vehicle ultra high-speed interfaces in automotive applications, such as low-voltage differe ntial signaling (lvds), high-definition multimedia interface (hdmi) and displayport interfaces against electrostatic discharge (esd). the device is housed in an ultra small sot1165-1 (xson10) surface-mounted design (smd) plastic package. 1.2 features and benefits ? system esd protection for lvds, hdmi and displayport interfaces ? line capacitance of only 0.6 pf with ? 0.05 pf matching capacitance between signal pairs ? ultra small xson10 package with design-f riendly ?pass-thru? signal routing ? aec-q101 qualified 1.3 applications the devices are designed for high-speed re ceiver and transmitter port protection: ? automotive a/v monitors , displays an d cameras 1.4 quick reference data [1] this parameter is guaranteed by design. PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces rev. 2 ? 23 january 2013 product data sheet table 1. quick reference data symbol parameter conditions min typ max unit v rwm reverse standoff voltage - - 5.5 v c ch channel capacitance f = 1 mhz; v bias =2.5v [1] -0.6-pf
PESD1LVDS all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 23 january 2013 2 of 12 nxp semiconductors PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces 2. pinning information 3. ordering information 4. limiting values [1] device stressed with ten non-repetitive esd pulses. [2] all pins to ground. table 2. pinning pin symbol description simplified outline graphic symbol 1ch1 ? negative channel 1 esd protection xson10 2 ch1+ positive channel 1 esd protection 3 gnd ground 4ch2 ? negative channel 2 esd protection 5 ch2+ positive channel 2 esd protection 6 n.c. not connected 7 n.c. not connected 8 gnd ground 9 n.c. not connected 10 n.c. not connected 15 10 4 7 3 8 2 96 transparent top view 24 3, 8 001aai619 1 5 table 3. ordering information type number package name description version PESD1LVDS xson10 plastic extremely thin small outline package; no leads; 10 terminals; body 1 ? 2.5 ? 0.5 mm sot1165-1 table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit t stg storage temperature ? 55 +125 ?c t amb ambient temperature ? 40 +85 ?c table 5. esd maximum ratings t amb =25 ? c unless otherwise specified. symbol parameter conditions min max unit v esd electrostatic discharge voltage iec 61000-4-2 (contact discharge) [1] [2] - ? 8kv
PESD1LVDS all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 23 january 2013 3 of 12 nxp semiconductors PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces 5. characteristics [1] this parameter is guaranteed by design. [2] between signal pin and pin n.c. table 6. esd standards compliance standard conditions iec 61000-4-2; level 4 (esd) > 8 kv (contact) mil-std-883; class 3b (human body model) > 8 kv fig 1. esd pulse waveform according to iec 61000-4-2 001aaa631 i pp 100 % 90 % t 30 ns 60 ns 10 % t r = 0.7 ns to 1 ns table 7. characteristics t amb =25 ? c unless otherwise specified. symbol parameter conditions min typ max unit v rwm reverse standoff voltage - - 5.5 v i rm reverse leakage current per channel; v=3.0v --1 ? a v br breakdown voltage i = 1 ma 6 - 9 v v f forward voltage - 0.7 - v c (i/o-gnd) input/output to ground capacitance f=1mhz; v bias =2.5v [1] -0.6-pf ? c (i/o-gnd) input/output to ground capacitance variation f=1mhz; v bias =2.5v [1] -0.05-pf c ch(mutual) mutual channel capacitance f=1mhz; v bias =2.5v [1] [2] -0.07-pf
PESD1LVDS all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 23 january 2013 4 of 12 nxp semiconductors PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces fig 2. esd clamping test setup and waveforms 50 r z c z dut (device under test) gnd gnd 450 rg 223/u 50 coax esd tester iec 61000-4-2 network c z = 150 pf; r z = 330 4 ghz digital oscilloscope 10x attenuator unclamped +8 kv esd pulse waveform (iec 61000-4-2 network) unclamped C8 kv esd pulse waveform (iec 61000-4-2 network) vertical scale = 2 kv/div horizontal scale = 15 ns/div vertical scale = 2 kv/div horizontal scale = 15 ns/div gnd clamped +8 kv esd pulse waveform (iec 61000-4-2 network) 006aac764 gnd clamped C8 kv esd pulse waveform (iec 61000-4-2 network) vertical scale = 20 v/div horizontal scale = 10 ns/div vertical scale = 20 v/div horizontal scale = 10 ns/div
PESD1LVDS all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 23 january 2013 5 of 12 nxp semiconductors PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces 6. application information the devices are designed to provide high-l evel esd protection for high-speed serial data buses such as lvds, hdmi and displayport data lines. when designing the printed-circu it board (pcb), careful consideration should be given to impedance matching, and signal coupling. basic application diagrams for the esd protection of an hdmi interface are shown in figure 3 . fig 3. application diagram of hdmi esd protection 006aac617 n.c. cec tmds_d2+ gnd tmds_gnd tmds_d1+ tmds_gnd tmds_d0+ tmds_gnd tmds_clk+ tmds_gnd tmds_clkC ddc_clk ddc_dat gnd +5 v hot plug detection PESD1LVDS tmds_d1C tmds_d2C tmds_ch2+ tmds_ch1+ tmds_ch1C tmds_ch2C tmds_ch2+ tmds_ch1+ tmds_ch1C tmds_ch2C gnd tmds_d0C hdmi connector PESD1LVDS 5 4 2 1 3 8 8 5 4 2 1 3 654 100 nf 123
PESD1LVDS all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 23 january 2013 6 of 12 nxp semiconductors PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces 7. test information 7.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualificat ion for discrete semiconductors , and is suitable for use in automotive applications.
PESD1LVDS all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 23 january 2013 7 of 12 nxp semiconductors PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces 8. package outline fig 4. package outline sot1165-1 (xson10) references outline version european projection issue date iec jedec jeita sot1165-1 - - - - - - sot1165-1_po 10-02-12 13-01-09 unit mm max nom min 0.5 0.05 0.00 0.25 0.20 0.15 0.45 0.40 0.35 2.6 2.5 2.4 1.1 1.0 0.9 0.2 0.43 0.38 0.33 0.05 a dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. xson10: plastic, extremely thin small outline package; no leads; 10 terminals; body 1 x 2.5 x 0.5 mm sot1165-1 a 1 c 0.127 bb 1 d (1) e (1) e 0.5 e 1 2 klv 0.1 wy 0.05 y 1 0.05 0 1 2 mm scale - - - x c y c y 1 b a terminal 1 index area d e detail x a c a 1 b k l b 1 e 1 e ac b v c w terminal 1 index area 10 6 terminal#3 identification 5 1
PESD1LVDS all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 23 january 2013 8 of 12 nxp semiconductors PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces 9. soldering reflow soldering is the only recommended soldering method. fig 5. reflow soldering footprint sot1165-1 (xson10) sot1165-1 remark: stencil of 75 m is recommended. a stencil of 75 m gives an aspect ratio of 0.77 with a stencil of 100 m one will obtain an aspect ratio of 0.58 footprint information for reflow soldering of xson10 package solder land plus solder paste occupied area solder land solder paste deposit solder resist dimensions in mm ay by c d hy 1.3 0.25 0.525 0.20 d 1 0.40 p 0.500 1.6 hx 2.45 generic footprint pattern refer to the package outline drawing for actual layout sot1165-1_fr hx by hy 0.05 c p d 0.05 d 1 ay
PESD1LVDS all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 23 january 2013 9 of 12 nxp semiconductors PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces 10. revision history table 8. revision history document id release date data sheet status change notice supersedes PESD1LVDS v.2 20130123 product data sheet - PESD1LVDS v.1 modifications: ? figure 4 ? package outline sot1165-1 (xson10) ? : updated PESD1LVDS v.1 20111010 product data sheet - -
PESD1LVDS all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 23 january 2013 10 of 12 nxp semiconductors PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces 11. legal information 11.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 11.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 11.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qualified for use in automotive applications. unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
PESD1LVDS all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 23 january 2013 11 of 12 nxp semiconductors PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any licens e under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. 11.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 12. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors PESD1LVDS esd protection for in-vehicle ultra high-speed interfaces ? nxp b.v. 2013. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 23 january 2013 document identifier: PESD1LVDS please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 13. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 application information. . . . . . . . . . . . . . . . . . . 5 7 test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.1 quality information . . . . . . . . . . . . . . . . . . . . . . 6 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 11.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 11.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 contact information. . . . . . . . . . . . . . . . . . . . . 11 13 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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